Staff Package Design Engineer - Power SiP/Module Packaging

About the role

Renesas Electronics, a global semiconductor company with about 21,000 employees in more than 30 countries, is looking for a Staff Package Design Engineer in Zhubei. The role designs and develops package and interconnect methods for power SiP/modules, wafer-level, flip-chip and multi-chip module packaging, and works closely with OSAT and contract manufacturers.

Key responsibilities

• Design and develop package and interconnect methods for power SiP/modules, wafer-level, flip-chip, multi-chip module and power device packaging.
• Understand wafer processing such as front-side metal, backgrind-backmetal, Taiko backgrinding, glass carrier bonding and grinding, patterned back metal and embedded die in substrate.
• Qualify package technologies for consumer, industrial and automotive power applications.
• Benchmark, select and qualify materials, processes and OSAT or contract manufacturers, then run DOE studies with them to optimise processes and set specifications.
• Work with product groups and reliability to qualify new packages and processes within the required timeframe, and resolve process integration issues through window checks on critical steps.
• Establish production controls, monitor quality and ensure a smooth transition into production, resolving process issues early so only high-quality parts reach customers.
• Keep up with advances in power SiP/module and flip-chip interconnect technologies, take part in packaging roadmap development and handle customer complaints with marketing, product, quality and operations teams.
• Maintain package design rules.

Required profile

• Masters or Bachelor degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 6-12 years of relevant experience in package development, emphasising power SiP/module, wafer-level and flip-chip packaging.
• Strong understanding of power SiP/module and flip-chip packaging methods, assembly processes, qualification methods, SPC and statistical analysis software.
• Knowledge of wire-bonding and multi-chip module technologies is a plus.
• Strong interpersonal, communication, analytical and presentation skills.