Director, Package Design Engineering

About the role

Renesas Electronics is looking for a Director of Package Design Engineering in Taichung. The role leads the global Packaging Sustaining Engineering organization that supports high-volume semiconductor manufacturing across internal assembly sites and OSAT partners in Asia, with executive ownership of HVM sustaining and global customer support.

Key responsibilities

• Lead Manufacturing Sustaining Engineering for all released production packages and own customer RMA, failure analysis, RCA, CAPA and customer communications.
• Drive yield improvement and process excellence using SPC, DOE, PFMEA and analytics, and lead cost optimization through process, material and manufacturing improvements.
• Takeover qualified products from NPI for mass production and publish weekly assembly engineering statistics with action plans for yield, cost and cycle time improvement.
• Address capacity or material supply issues with SCM to secure on-time delivery, and work with OSATs and QA on assembly-related quality or RMA issues.
• Define the Renesas OSAT strategy with Procurement, SCM and Package Development, manage OSAT suppliers, audits, scorecards and technology alignment.
• Handle PCN and PDN issues, lead the Material Review Board and disposition of abnormal materials, and run industry benchmarking and competitive analysis on substrate, material, equipment suppliers and competitors.

Required profile

• 15+ years of assembly engineering experience.
• MS or PhD in Materials Science or Mechanical Engineering.
• Extensive experience supporting high-volume manufacturing across multiple semiconductor package platforms, including automotive packaging.
• Solid OSAT management experience and experience on various package types (FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, module, 2.5D).
• Experience with package substrates (MSAP, ETS, tenting, ABF), SMT processes, warpage and board-level reliability testing.
• Familiarity with industry standards such as JEDEC, IPC and automotive qualifications.

Required skills

• SPC, 8D, RCA, SYL/SBL
• SPC, DOE, PFMEA
• Leadership, communication and schedule management skills