MBIST Diagnostics Engineer, up to Sr. Staff

About the role

Qualcomm Semiconductor Limited is looking for an experienced engineer to lead the development of memory built‑in self‑test (MBIST) diagnostics, memory repair, failure analysis, and advanced memory diagnostic flows for next‑generation System‑on‑Chips (SoCs) and stacked memory architectures.

Key responsibilities

• Lead SRAM MBIST diagnosis, memory failure analysis, and repair activities across complex SoC designs.
• Analyze ATE data logs, fail signatures, repair data, and silicon debug results to isolate memory failures and determine root causes.
• Develop and enhance diagnostic algorithms, redundancy analysis, BIRA, BISR, ECC, self‑repair, and post‑repair validation methodologies.
• Architect MBIST diagnostic solutions for embedded memories, 3DIC, 2.5D, stacked memory, HBM, DRAM, and chiplet‑based architectures.
• Define MBIST controller requirements, diagnostic modes, fail capture mechanisms, error logging, and repair access flows.
• Support investigations during HTOL failures, customer‑return debug, production excursions, and high‑volume manufacturing diagnostics.
• Correlate manufacturing test results with silicon behavior and perform yield learning.

Required profile

• Proven experience in memory diagnostics, MBIST architecture, and silicon debug for advanced SoC designs.
• Strong analytical skills to interpret test data and drive root‑cause analysis.
• Ability to work cross‑functionally with design, validation, reliability, yield, and packaging teams.

Required skills

• SRAM MBIST diagnosis
• Memory failure analysis and repair
• Diagnostic algorithm development
• BIRA, BISR, ECC, self‑repair techniques
• 3DIC, 2.5D, stacked memory, HBM, DRAM, chiplet architectures
• MBIST controller design and fail capture
• ATE data log analysis
• Silicon debug and yield learning