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Principal Engineer – ATE Hardware Design

nxp · Hsinchu

New
Senior 🇬🇧 English
Advantest V93000 EXA Scale Teradyne J750 UltraFLEX UltraFLEXplus signal integrity power integrity multilayer PCB design Cadence Allegro Keysight ADS Ansys HFSS

Job description

About the role

We are looking for a highly experienced Principal Engineer to lead the end‑to‑end design, development, integration and validation of advanced ATE test hardware. This senior technical position combines deep hands‑on expertise with cross‑functional influence to deliver robust, high‑performance test solutions for new‑product introduction and high‑volume manufacturing.

Key responsibilities

  • Own the complete ATE test hardware development lifecycle from requirements through production support.
  • Design and review complex test hardware such as load boards, probe cards, sockets and related interfaces for wafer‑sort and final‑test applications.
  • Lead schematic, stack‑up, component‑placement, routing and design reviews with focus on signal integrity, power integrity, manufacturability and reliability.
  • Perform SI/PI analysis, simulation, hardware bring‑up, debugging and root‑cause resolution.
  • Partner with Business Line Test Engineering, Product Engineering, Operations, Quality, Procurement and external manufacturing partners to ensure alignment on quality, cost and schedule.

Required profile

  • Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering.
  • Minimum 10 years of experience in ATE test hardware design and development within the semiconductor industry.
  • Proven track record delivering complex test hardware solutions in fast‑paced new‑product development and manufacturing environments.

Required skills

  • Hands‑on experience with ATE platforms such as Advantest V93000, EXA Scale, Teradyne J750, UltraFLEX and UltraFLEXplus.
  • Expertise in high‑speed digital design, signal integrity, power integrity and multilayer PCB design.
  • Proficiency with Cadence Allegro, Keysight ADS, Ansys HFSS or equivalent electronic design and simulation tools.
  • Strong knowledge of semiconductor back‑end assembly, test flows and high‑volume manufacturing environments.

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Source : ats:workday

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Published 9 hours ago

Expires 1 month from now

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nxp

Hsinchu