Packaging Quality Engineer

About the role

Cisco's Component Quality and Technology (CQT) organization is looking for a Packaging Quality Engineer in Taipei to work with its optics OSATs and packaging supply chain. The role ensures operational consistency and quality standards by collaborating with internal stakeholders and external OSAT partners on optical interconnects.

Key responsibilities

• Establish quality control protocols and identify deviations in high-volume packaging production lines to drive process stability.
• Manage packaging process control plans focused on bumping, die attach, wirebonding and flip-chip reliability.
• Oversee statistical process control (SPC) across OSAT production lines for real-time monitoring and proactive correction of process variables.
• Drive continuous improvement using statistical analysis and quality methodologies to solve yield and reliability challenges.
• Analyze quality metrics to spot systemic issues early and mitigate supply chain risks.
• Partner with engineering and supply chain teams on on-site audits and process assessments.

Required profile

• Bachelor's degree in Engineering (Chemical, Materials or related field) from an accredited university.
• Minimum of 5 years of supplier quality engineering experience.
• Expertise in semiconductor packaging processes, substrates, testing, assembly failure analysis and quality assurance.
• Demonstrated experience managing OSAT-side quality metrics, conducting on-site process audits and mitigating supply chain risks.

Required skills

• Quality systems and methodologies: SPC, OCAP, FMEA and APQP.
• Preferred: in-depth knowledge of semiconductor substrates and OSAT processes, root-cause troubleshooting, advanced statistical analysis of large data sets, and strong communication and stakeholder management skills.