Component Engineering Technical Leader - Thermal Solutions

About the role

Cisco is looking for a Component Engineering Technical Leader to join its Technology and Quality Group in Supply Chain Operations in Taipei. The role contributes to developing, road-mapping and implementing sophisticated end-to-end thermal solutions for Cisco's products, working with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers and internal partners.

Key responsibilities

• Lead the system thermal technology roadmap with suppliers and partners to meet Cisco product needs.
• Develop the quality strategy for liquid cooling manufacturing and investigate large-scale liquid cooling solutions for hardware systems.
• Analyse thermal performance trade-offs of package design elements (substrate, underfill, thermal interface material, heat spreader) and chip thermal gradients from test data.
• Develop test plans and qualification requirements for pumps, heat pipes, vapor chambers, heat sinks and liquid cooling, and engage with ODM and component vendors on design, test and production.
• Publish case studies and technical papers on thermal analysis of cooling systems, and set parameters for thermal design and testing.
• Contribute to CFD models simulating device-level cooling schemes, and integrate circuit thermal simulation and testing with system-level cooling.
• Drive supplier ecosystem development, take part in industry consortia and conferences, and collaborate with academia and partners.
• Validate mechanical designs of electronic assemblies and coordinate circuit packaging technologies (BGA, flip-chip BGA, 2.5D and 3D packaging).

Required profile

• BS in Mechanical, Thermal or Chemical Engineering.
• 10+ years of experience designing, simulating and testing thermal solutions for electronic devices and systems.
• Extensive experience with advanced air-cooling technologies (vapor chambers, remote heat sinks, thermal interface materials, fans and fan trays).
• Experience with liquid cooling and/or immersion cooling preferred.
• Preferred: MS or PhD in Mechanical or Chemical Engineering or a related field, and 15+ years of proven microelectronics thermal cooling experience.
• Preferred: experience with JEDEC JESD 51 thermal testing standards and thermal interface material conductivity testing.
• Experience troubleshooting thermal validation with data acquisition systems, airflow and environmental chambers, and familiarity with manufacturing processes for liquid cooling components.
• Able to lead by influence, work independently on multiple projects, communicate with executives and present to diverse audiences.