Senior Engineer, Semi Packaging Engineering
analogdevices · Vendor
Job description
About the role
Analog Devices, a global semiconductor company, is looking for a Senior Engineer in semi-packaging engineering. The role focuses on developing advanced packaging solutions for semiconductor devices across several market segments, meeting demanding requirements for performance, reliability, manufacturability and cost.
Key responsibilities
- Drive and support the design, development and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package and module-based products.
- Perform electrical simulations of IC packages, modules or systems using commercial simulation tools.
- Work with cross-functional teams to understand product and packaging requirements, identify customer needs and resolve complex technical issues.
- Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimise manufacturing processes and improve yield.
- Work with quality and reliability teams to establish reliability criteria for semiconductor products across market applications.
- Develop and maintain package design guidelines, process specifications and technical documentation.
Required profile
- PhD or Master's degree in Electrical Engineering, Mechanical Engineering or Materials Science.
- 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
- Good understanding of IC packaging materials and their mechanical, thermal and electrical behaviour.
- Strong knowledge of IC package structures, substrate technologies and semiconductor assembly processes.
- Experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS or similar.
- Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation and circuit simulation.
- Experience with Cadence Allegro is a plus.
- Strong communication skills and ability to work in cross-functional and global teams.
Positions requiring access to technical data may require export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State; applicants who are not U.S. citizens or permanent residents may need to undergo an export licensing review. The role requires travel about 10% of the time and is a day shift.
Questions fréquentes
Why are you reporting this job?
Explore further
Salaries, guides and searches in Taiwan.
Apply in 30 seconds
Enter your email to apply. An account will be created automatically.
By continuing, you accept our terms of use.
Already have an account? Login
A question about this job?
Ask it here: you will get the full job summary by e-mail, right away.
Published 1 week ago
Expires 1 month from now
9 views · 0 interested
Boost your chances
Upload your CV — we will match you with relevant openings.
Analyzing your CV...
analogdevices
Vendor
Related job offers
-
Senior Engineer, Semi Packaging Engineering
analogdevices Vendor -
Backend Manufacturing Engineer - Sustaining (SSD HVM)
Solidigm Hsinchu -
Supplier Quality Engineer (Mechanical Focus)
Solidigm Hsinchu -
Senior Staff Package Design Engineer - MIS Substrate/FC Expose Die
Renesas Electronics Taipei -
Senior Staff Package Design Engineer (Power/GaN Packaging)
Renesas Electronics Kaohsiung