Cloud Hardware Design Engineer – Rack‑Level AI Systems

About the role

The Cloud Hardware Design Engineer will design and develop motherboards, add‑in cards and modules for Qualcomm’s next‑generation AI System‑on‑Chip (SoC) and System‑in‑Package (SiP) solutions. Working from concept through production, the role focuses on rack‑level AI inference hardware for liquid‑cooled data centres.

Key responsibilities

• Develop schematics, PCB layouts, component selections and mechanical/thermal designs for AI accelerator cards and servers.
• Collaborate with cross‑functional teams (mechanical, thermal, signal integrity, validation, manufacturing) and ODM partners to drive projects from concept to volume production.
• Define functional specifications, test plans and validation strategies for system‑level, card‑level and rack‑level architectures.
• Support hardware bring‑up, debugging, and system integration across chassis, backplane, cabling and power delivery.
• Provide technical oversight for factory processes, ensure quality, and contribute to Statements of Work and ODM product requirements.
• Coordinate technical training for ODMs and align multiple development sites on design milestones.

Required profile

• Proven experience in rack‑level system integration, including chassis, backplane, airflow and thermal management.
• Strong background in hardware design for AI accelerators, memory, I/O and power delivery.
• Ability to work with ODMs and cross‑functional teams to resolve architecture and design issues.

Required skills

• PCB design and schematic capture (e.g., Altium, Cadence).
• Signal integrity analysis and high‑speed layout.
• Power delivery design (PDUs, VRMs, PMICs) and budgeting.
• Thermal analysis and cooling solution design.
• Hardware bring‑up, debugging and validation at board and rack levels.
• Experience with mechanical constraints, EMI shielding and data‑center compliance.