Wafer Manufacturing Section Manager

About the role

We are seeking a Wafer Manufacturing Section Manager to lead high‑volume semiconductor front‑end production in a fast‑paced, multinational environment. The role combines manufacturing execution leadership with strong process collaboration.

Key responsibilities

• Lead daily wafer fabrication operations to meet output, cycle time, and delivery targets.
• Manage and develop production teams in a cleanroom environment.
• Monitor and drive manufacturing KPIs such as WIP, cycle time, OEE, and tool utilization.
• Ensure shift execution discipline and production stability.
• Work closely with Process Engineering, Equipment Engineering, and Yield teams to support process control and excursion handling.
• Drive continuous improvement on yield, defect reduction, and productivity, including new process qualification and technology transfer.
• Lead Lean/Six Sigma initiatives, optimize fab capacity and resource allocation.
• Ensure compliance with safety, quality, and fab operation standards.

Required profile

• Bachelor’s degree or higher in Engineering (IE, planning, EE, Materials, Chemical, Physics, etc.).
• 6+ years experience in semiconductor wafer fabrication (frontend).
• 2+ years team leadership experience (supervisor/shift lead).
• Strong understanding of wafer process flow (Lithography, Etch, Thin Film, Diffusion, CMP).
• Experience in high‑volume manufacturing environments and shift/line management.
• Proven ownership of WIP handling, yield and cycle‑time improvement.
• Effective cross‑functional alignment with Process and Equipment Engineering.
• Strong English communication skills and data‑driven decision making.

Required skills

• Semiconductor wafer fabrication.
• Lithography, Etching, Thin‑film deposition, Diffusion, CMP.
• Lean Six Sigma methodologies.
• Yield analysis and improvement.
• Manufacturing KPI management (OEE, WIP, cycle time).
• Process control and root‑cause analysis.