Principal Engineer, Advanced Package Technology

About the role

The Marvell Advanced Packaging R&D team develops package design and technology to meet the electrical, mechanical, thermal and system requirements of next-generation HPC, AI and networking solutions. The Principal Engineer leads the packaging technology roadmap for AI XPU, XPU-attach and Switch, working on 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates.

Key responsibilities

• Develop the packaging technology roadmap and recommend technologies beyond what is currently available, creating and protecting IP
• Create new package concepts, run routing feasibility, signal and power integrity studies and build proof-of-concept samples
• Define package architecture including chiplet topology, interposer/substrate scaling, power delivery network strategy and thermal design
• Lead co-design across silicon design, floorplanning, PDN modeling and mechanical/thermal reliability, and partner with silicon teams on die floorplan, bump map, TSV and RDL
• Work with OSATs and foundries on process capability, manufacturability, yield and cost, and drive qualification and reliability validation to volume readiness

Required profile

• Bachelor's or master's degree in mechanical engineering, material science or a related field with 8-10 years of experience, or PhD/post-doc with 5+ years
• Experience managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries
• Experience interfacing with product design teams on floorplanning, package design input and PDN design
• Ideal candidate: data center AI accelerator, networking silicon or custom HPC silicon background, experience setting roadmaps, silicon disaggregation and memory integration, VNA and TDR measurements, and influencing senior stakeholders

Required skills

• Signal and power integrity simulations and analysis for 2.5D and 3D packages (Cadence Sigrity PowerSI, Ansys SIwave)
• EM simulations with Ansys HFSS, SI-Wave, Cadence Clarity
• Cadence APD or PCB editor for routing feasibility studies
• Understanding of CoWoS, EMIB, CPO and CPC technologies

What we offer

• Eligibility for Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers
• Competitive compensation and benefits