Senior Field Readiness Engineer
amat · Hsinchu
Job description
About the role
The Field Product Readiness Engineer IV leads service product readiness for complex semiconductor equipment across Etch, Metal Deposition (MDP) and Dielectric Deposition (DDP) lines. The role bridges field observations, tool data and customer feedback to ensure smooth transitions from early readiness activities through NPI and high‑volume manufacturing.
Key responsibilities
- Validate readiness for new modules, multi‑site streams and complex products, covering documentation, tooling, training, spare strategy and AIx readiness.
- Drive closure of cross‑functional gaps, capture early‑deployment lessons and embed them into installation, preventive‑maintenance and corrective‑maintenance procedures.
- Lead field sprint planning, execution and retrospectives, managing backlog quality, risk tracking and KPI reporting.
- Provide technical recommendations to SBU, BU, GPS and field teams to improve serviceability and reduce readiness gaps.
Required profile
- 7‑10 years hands‑on experience with Etch, MDP or DDP semiconductor equipment.
- Bachelor’s degree in mechanical, electrical, materials, chemical, industrial, automation engineering or related field.
- Proven project‑management discipline using agile/sprint delivery, backlog management and KPI tracking.
- Willingness to travel up to 50% for installation, readiness activities and knowledge transfer.
Required skills
- Etch, Metal Deposition (MDP) and Dielectric Deposition (DDP) product expertise.
- Agile/sprint delivery, Jira and statement‑of‑work development.
- AIx tools, predictive‑maintenance analytics and process‑optimization modeling.
- FMECA, control‑plan creation and escalation‑structure management.
What we offer
- Supportive work culture that encourages learning, development and career growth.
- Comprehensive health and wellbeing programs for employees on‑site and remotely.
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amat
Hsinchu