Packaging Development Engineer (MEMS Sensors)

About the role

Bosch Taiwan is looking for a Packaging Development Engineer focused on MEMS sensor products. The role covers package design, process development and sample qualification for electronic MEMS sensors used in automotive and consumer electronics, working closely with internal engineering teams and external suppliers.

Key responsibilities

• Define and drive milestones: set major package-development milestones and ensure on-time delivery through proactive planning, progress tracking and risk mitigation.
• Coordinate package design and process development for electronic MEMS sensors with internal engineering teams and external suppliers.
• Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.
• Oversee sample manufacturing and process qualification at assembly partners.
• Communicate and collaborate with international stakeholders in English across product engineering, supply chain and quality teams.

Required profile

• 3 to 8 years of experience in semiconductor packaging and assembly (LGA, BGA, DFN, WLCSP).
• Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.
• Demonstrated success in multicultural, international projects.
• Excellent verbal and written English; willingness to travel as required.

Required skills

• Strong background in semiconductor assembly technologies and materials.
• Agile approach to adjusting project plans to evolving technical requirements and customer needs.