PCB Design Engineer

About the role

We are looking for a PCB Design Engineer to lead the development of high‑speed test hardware. You will translate electrical engineering requirements into robust PCB architectures that support multi‑site automated test equipment and high‑volume manufacturing.

Key responsibilities

• Review and contribute to schematics, ensuring correct interpretation of power, precision supplies, ATE interfaces, high‑speed MIPI and control signals.
• Define PCB stack‑up, controlled impedance, PDN, decoupling, layer assignment and length‑matching strategies.
• Architect load boards, interface/slot boards and pallets that scale from prototype bring‑up to dozens‑to‑hundreds of parallel test sites.
• Own system‑level signal and power integrity, including impedance, PDN budgeting, IR‑drop analysis and loop stability across the full tester‑to‑DUT path.
• Drive PCB fab, CM and OSAT partners, authoring constraints, reviewing layouts and ensuring correct execution.
• Ensure designs are manufacturable, reproducible and qualified for high‑volume deployment, addressing DFM, DFA, DFT and material reliability.
• Carry the design through hand‑off, bring‑up, debug and volume release, collaborating with mechanical, test and silicon teams.

Required profile

• Proven schematic capture and review ability with strong analog, digital and power fundamentals.
• Experience designing test/ATE hardware, multi‑site load boards and high‑speed interfaces.
• Hands‑on expertise with professional EDA tools (Cadence Allegro/OrCAD or equivalent) for stack‑up, impedance and SI/PI.
• Track record of managing PCB fab/CM/assembly suppliers and driving correct execution.
• Excellent cross‑functional communication and ability to negotiate trade‑offs with EE and ME teams.
• Lab proficiency with oscilloscopes, DMMs, power supplies and PCB rework/soldering.

Required skills

• Cadence OrCAD / Allegro (or equivalent HDL‑based capture)
• PCB layout, controlled impedance, PDN design, signal and power integrity analysis
• High‑speed MIPI, C‑PHY/D‑PHY routing
• Multi‑site load board and interface/slot board design
• OSAT coordination and DFM/DFA/DFT considerations
• High‑speed oscilloscope, digital multimeter, power supply operation
• PCB rework, soldering, BOM and release management